Fujii, H., Takada, Y., Tsuji, N., & Nogi, K. (2004, September). Friction stir welding of ultrafine grained materials. 5th International Symposium.
Fujii H, Takada Y, Tsuji N, et al. "Friction stir welding of ultrafine grained materials". 5th International Symposium (Sep.2004).
Fujii, H, Takada, Y, Tsuji, N, et al. "Friction stir welding of ultrafine grained materials". 5th International Symposium (Sep.2004).
Fujii H., Takada Y., Tsuji N. and Nogi K.Friction stir welding of ultrafine grained materials. 5th International Symposium. 2004 Sep; .
Fujii, et al 2004, 'Friction stir welding of ultrafine grained materials', 5th International Symposium. Available from: https://www.twi-global.com/technical-knowledge/fsw-symposium-papers/FSWSymposia-200409-4BPaper01.pdf.
Fujii H, Takada Y, Tsuji N, Nogi K. Friction stir welding of ultrafine grained materials. 5th International Symposium. 2004;. https://www.twi-global.com/technical-knowledge/fsw-symposium-papers/FSWSymposia-200409-4BPaper01.pdf.
Fujii HH, Takada YY, Tsuji NN, Nogi KK. Friction stir welding of ultrafine grained materials. 5th International Symposium. 2004 Sep;. https://www.twi-global.com/technical-knowledge/fsw-symposium-papers/FSWSymposia-200409-4BPaper01.pdf.
Friction stir welding of ultrafine grained materials
- Fujii H. ,
- Takada Y. ,
- Tsuji N. ,
- et al
- Fujii H. ,
- Takada Y. ,
- Tsuji N. and
- Nogi K.
September 2004
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Description
Ultrafine grained test pieces of aluminium, copper and steel produced by the accumulative roll bonding process were friction stir butt welded at various revolutionary pitches, and the microstructures and mechanical properties (tensile strength, Vickers hardness profiles) of the joints were evaluated. The materials used were 1050-O aluminium and oxygen-free copper (both 2 mm thickness, welded by SKD61 tool) and interstitial-free steel (1.6 mm thickness, welded by WC tool). TIG welding was also performed for comparison. The adverse effect of abnormal grain growth in the HAZ on the strength of friction stir welded copper joints is reported.
5th International Symposium, 14-16 Sep 2004, Session 4B: Process Developments, Paper 01
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