TWI


(2018, June). Meshfree numerical simulation of hybrid friction stir welding with adhesive bonding. 12th International Symposium.
. "Meshfree numerical simulation of hybrid friction stir welding with adhesive bonding". 12th International Symposium (Jun.2018).
. "Meshfree numerical simulation of hybrid friction stir welding with adhesive bonding". 12th International Symposium (Jun.2018).
Meshfree numerical simulation of hybrid friction stir welding with adhesive bonding. 12th International Symposium. 2018 Jun; .
2018, 'Meshfree numerical simulation of hybrid friction stir welding with adhesive bonding', 12th International Symposium. Available from: https://www.twi-global.com/technical-knowledge/fsw-symposium-papers/FSWSymposia-201806-3BPaper02.pdf.
. Meshfree numerical simulation of hybrid friction stir welding with adhesive bonding. 12th International Symposium. 2018;. https://www.twi-global.com/technical-knowledge/fsw-symposium-papers/FSWSymposia-201806-3BPaper02.pdf.
. Meshfree numerical simulation of hybrid friction stir welding with adhesive bonding. 12th International Symposium. 2018 Jun;. https://www.twi-global.com/technical-knowledge/fsw-symposium-papers/FSWSymposia-201806-3BPaper02.pdf.

Meshfree numerical simulation of hybrid friction stir welding with adhesive bonding

12th International Symposium
June 2018

Repository

Description

With regard to the development of hybrid friction stir welding-adhesive bonding (FSW-AB) for the fabrication of lap joints, a mesh free coupled thermomechanical simulation of the FSW-AB process was undertaken using the SPHriction-3D code and the numerical results were compared with experimental results. Based on a Lagrangian frame of reference, continuum mechanics equations describing the physics of the FSW-AB process were cast into an amenable set of algebraic equations using a weak-strong form approach called smoothed particle hydrodynamics. A thermal degradation model of the adhesive in the FSW-AB joint was formulated from Fourier transform infrared spectroscopy analysis of Teroson 5089 epoxy based adhesive at temperatures in the range of room temperature to 210 deg.C. The numerical simulation framework was used to determine process parameters and joint design to facilitate minimum adhesive degradation

12th International Symposium, 26-28 Jun 2018, Session 3B: Modelling I, Paper 02

Show Full Abstract Collapse Abstract

Related Records

Loading...